Vibration simulation and fatigue life estimation of a printed circuit board using a validated model

Document Type : Invited by Davoud Younesian

Authors

1 MSc Student, School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran, Iran

2 Assistant Professor, Department of Mechanical Engineering, Faculty of Engineering, University of Mohaghegh Ardabili, Ardabil, Iran

3 Assistant Professor, School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran, Iran

Abstract

An electronic package consists of printed circuit boards (PCBs) placed in a casing joined together. Electronic circuit boards should operate properly in different conditions including thermal cycling, vibrations, and mechanical shock. Printed circuit boards require to be analyzed electrically as well as mechanically for optimized performance. In this paper, the finite element analysis (FEA) of a PCB is carried out in ANSYS and the results are validated utilizing modal testing. The natural frequencies and mode shapes of the PCB are determined, and the effect of mechanical shock on the PCB is also evaluated. The results demonstrate that the PCB has three resonance frequencies in the range of 0-1000 Hz. The mode shapes related to each natural frequency are also obtained employing ANSYS software. These data can be used for fatigue life estimation and mechanical shock analysis. In this work, the fatigue life estimation of wires and solder joints under sinusoidal and random vibrations are estimated as well by using the Steinberg's method. The results illustrate that random vibration has more impact than harmonic vibration on the fatigue life of solder joints and wires according to the Peugeot standard. Also, the results have passed the Peugeot standard qualification in both random and harmonic vibrations.

Highlights

  • A Printed Circuit Board (PCB) is modelled by finite element method.
  • The PCB model is validated experimentally using modal testing and simulated under mechanical shock.
  • The fatigue life of the PCB is estimated using Steinberg's method.
  • Industrial vibration design guidelines for PCBs are derived.

Keywords

Main Subjects

References

[1] A. Fatemi, L. Yang, Cumulative fatigue damage and life prediction theories: a survey of the state of the art for homogeneous materials, International journal of fatigue, 20 (1998) 9-34.
[2] A. Perkins, S.K. Sitaraman, Vibration-induced solder joint failure of a ceramic column grid array (CCGA) package, in:  2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No. 04CH37546), IEEE, 2004, pp. 1271-1278.
[3] S. Liguore, D. Followell, Vibration fatigue of surface mount technology (SMT) solder joints, in:  Annual Reliability and Maintainability Symposium 1995 Proceedings, IEEE, 1995, pp. 18-26.
[4] J. Xia, L. Yang, Q. Liu, Q. Peng, L. Cheng, G. Li, Comparison of fatigue life prediction methods for solder joints under random vibration loading, Microelectronics Reliability, 95 (2019) 58-64.
[5] R.A. Amy, G.S. Aglietti, G. Richardson, Reliability analysis of electronic equipment subjected to shock and vibration–A review, Shock and Vibration, 16 (2009) 45-59.
[6] D. Barker, A. Dasgupta, M. Peeht, PWB solder joint life calculations under thermal and vibrational loading, Journal of the IES, 35 (1992) 17-25.
[7] R.L. Eshleman, Shock and vibration technology with applications to electrical systems, in, 1972.
[8] D.S. Steinberg, Vibration analysis for electronic equipment, (2000).
[9] J. Pitarresi, A. Primavera, Comparison of modeling techniques for the vibration analysis of printed circuit cards, (1992).
[10] P. Engel, Structural analysis for circuit card systems subjected to bending, (1990).
[11] T. Renner, Mechanical Design of Circuit Boards Using Finite Element Analysis, in:  ANSYS Conference Proceedings, 1985, pp. 12-11.22.
[12] V. Somashekar, S. Harikrishnan, P.A. Ahmed, D. Kamesh, Vibration response prediction of the printed circuit boards using experimentally validated finite element model, Procedia Engineering, 144 (2016) 576-583.
[13] R.A. Amy, G.S. Aglietti, G. Richardson, Sensitivity analysis of simplified Printed Circuit Board finite element models, Microelectronics reliability, 49 (2009) 791-799.
[14] D.J. Ewins, Modal testing: theory and practice, Vol. 15, Letchworth: Research studies press, (1984).
[15] P. Peugeot  Vibration, B217120-B 34 'Devices on an usprung mass.
Journal of Theoretical and Applied Vibration and Acoustics
Volume 7, Issue 1
January 2021
Pages 29-42

Files

Share

How to cite

Statistics